VOTAN ® G | Laser Separation (glass, ceramics)

Inside Line Products VOTAN ®, laser machining brittle materials like glass, ceramics and semiconductors. Specific fields of application in this case are for display glass, ceramic substrate and thin film solar (photovoltaic).

The laser separation can be done by thermal laser separation (TLS) or induction (lbis). With the TLS procedure can scratch and break (Scribe & Break) or cut completely (Full Cut) brittle materials.
With the procedure can be completely cut lbis glass.

Advantage

• Edge glass free of microcrackss.
• No deterioration of surface coatings.
• Increased flexural strength up to 50% .compared to conventional separation procedures.
• No other steps are necessary processing (grinding, polishing).
• Breakout force adjustable (only TLS).
• Process without Contact Us.
• No wear of the tool.
• High degree of automation possible

In this section (see sub menu):

- Introduction >
- Plastic materials >
- Metallic materials >
- Laser microperforation >
- Packaging >

Over these lines:
The machine VOTAN ® G is for machining brittle materials like glass, ceramics and semiconductors and thin film solar (photovoltaic).

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